@book{Bhutani2019, abstract = { This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.Umfang: XVIII, 215 S.Preis: €47.00 | £43.00 | $83.00}, address = {Karlsruhe}, author = {Bhutani, Akanksha}, doi = {10.5445/KSP/1000095763}, isbn = {978-3-7315-0945-5}, keyword = {Millimeterwellensystem, FMCW Radar, LTCC-Mehrlagen-Keramiktechnologie, Millimeterwave system, LTCC multilayered ceramic technology, Integrated-circuit packaging concept, Surface-mounted device}, month = {Oct}, pages = {254}, publisher = {KIT Scientific Publishing}, title = {Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz}, year = {2019} }