TY - BOOK AU - Xu, Yilin PY - 2023 TI - Hybrid photonic assemblies based on 3D-printed coupling structures AB - Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).Umfang: XV, 265 S.Preis: 49.00 PB - KIT Scientific Publishing CY - Karlsruhe KW - Photonische Aufbau- und Verbindungstechnik KW - integrierte photonische Schaltkreise KW - Multiphotonenlithographie KW - additive 3D Mikrofabrikation KW - Mikrooptik KW - photonic packaging KW - photonic integrated circuits (PIC) KW - multi-photon lithographie KW - additive 3D micro-fabrication KW - micro-optics SN - 978-3-7315-1273-8 DO - 10.5445/KSP/1000154744 SE - 292