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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Umfang: XXI, 222 S.
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Lindenmann, N. 2018. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000077963
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Veröffentlicht am 9. Februar 2018
Englisch
256
| Paperback | 978-3-7315-0746-8 |