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  • Hybrid photonic assemblies based on 3D-printed coupling structures

    Yilin Xu

    Band 37 von Karlsruhe Series in Photonics & Communications
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    Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).

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    Empfohlene Zitierweise
    Xu, Y. 2023. Hybrid photonic assemblies based on 3D-printed coupling structures. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000154744
    Xu, Y., 2023. Hybrid photonic assemblies based on 3D-printed coupling structures. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000154744
    Xu, Y. Hybrid Photonic Assemblies Based on 3d-printed Coupling Structures. KIT Scientific Publishing, 2023. DOI: https://doi.org/10.5445/KSP/1000154744
    Xu, Y. (2023). Hybrid photonic assemblies based on 3D-printed coupling structures. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000154744
    Xu, Yilin. 2023. Hybrid Photonic Assemblies Based on 3d-printed Coupling Structures. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000154744




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    Weitere Informationen

    Veröffentlicht am 24. April 2023

    Sprache

    Englisch

    Seitenanzahl:

    292

    ISBN
    Paperback 978-3-7315-1273-8

    DOI
    https://doi.org/10.5445/KSP/1000154744