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This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
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Bhutani, A. 2019. Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000095763
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Veröffentlicht am 17. Oktober 2019
Englisch
254
| Paperback | 978-3-7315-0945-5 |