Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Umfang: XV, 265 S.
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Xu, Y. 2023. Hybrid photonic assemblies based on 3D-printed coupling structures. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000154744
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Veröffentlicht am 24. April 2023